• Dimension：L848 x W375.6 x H180.5（mm）

• Power：>20W@400KHz

• Max Energy：>50μJ@400KHz

• Pulse width：<400fs

• Beam Quality：TEM00（M²<1.4）

• Beam Roundness：>90%

• Low-cost; maintenance-free

• Narrow pulse femtosecond; Excellent pulse quality and excellent stability

• High beam quality; Suitable for precision processing

• Real-time state monitoring

• User-friendly interface

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Applications

• OLED dicing and drilling

• Glass, ceramic, sapphire dicing and drilling

• Dicing of semiconductor materials

• Fuel injector nozzles drilling dicing of films

• Micro-nano processing

• Dicing of films

• Precision marking

• Other precision processing