• Dimension：L633 x W354 x H173（mm）

• Power：>20W@1MHz

• Max Energy：>20μJ@1MHz

• Pulse width：<400fs

• Beam Quality：TEM00（M²<1.4）

• Beam Roundness：>90%

• Low-cost; maintenance-free

• Narrow pulse femtosecond; Excellent pulse

• High beam quality; Suitable for precision

• Real-time state monitoring

• User-friendly interface

Applications

• OLED dicing and drilling

• Glass, ceramic, sapphire dicing and drilling

• Dicing of semiconductor materials

• Dicing of films

• Micro-nano processing

• Precision marking

• Other precision processing