 | Auto Alignment and Bonding Machine FA6000 series Auto-Alignment /Bonding system perform ultra-precise and high speed alignment in PLC chip based component manufacturing and research | |||
 | Probe Station It is desirable to make optical measurement of the individual device before wafers are cut into individual die. By mapping a wafer, a manufacturer can bin the die after cutting, separating the good from the bad and segregating the good ones by power output, wavelength, or other parameters. Performing this step while the devices are still in wafer form allow the manufacturer to reject the bad ones up front before spending money to package them. | |||
 | LIV Test System The light intensity (L) - current (I) - voltage (V) (LIV) sweep test is a series of measurements performed on laser diodes (LDs) to determine their operating characteristics (DC characteristics). For vertical cavity surface emitting laser (VCSEL), the L-I-V test identifies failed devices early in the production process, so expensive non-DC domain tests can be performed more cost-effectively on the remaining higher yield components. | |||
 | Ink Dotter System We design and manufacture custom inking system to meet your specification needs | |||
